Knowledge*on Inc. :::: 6" InGaP HBT Foundry Service:::::

To try our 6" InGaP HBT foundry services, we provide sample trials as follows:

1) Regular Shuttle Run (RSR):
    => RSR schedule for Y2002
    - Four customers will share one mask.
       A quarter of the mask will be allotted to each customer.

    - A customer can only use a stepping tile size of 7.4mm X 7.4mm including scribe line
       because they’re using a shared mask.
    - The customer can choose die sizes (scribe line center-to-scribe line center).
       But maximum and minimum die sizes are restricted as below.
    - The width of Scribe Line is 100㎛.

    -Required PCM area for RSR to each customer is 7.4mm X 1.1mm (including scribe line).


2) Multi-Project Wafer (MPW):
    => MPW schedule for Y2002
    - 16 customers will share a mask.
    - A stepping tile size of 3.75mm X 3.75mm including scribe line is allotted
      to each customer due to using a shared mask.
    - The customer can choose die sizes (scribe line center-to-scribe line center).
      But maximum and minimum die sizes are restricted as below.

- The width of Scribe Line is 100㎛.

3) Prototype Wafer Run (PWR):
    - The maximum stepping tile size is 15mm x 15mm on the wafer.
    - The minimum die size is 0.7mm X 0.7mm(scribe line center-to-scribe line center).
      In the either case, the customer can choose stepping tile sizes freely.
    - Required PCM area for PWR is 7.4mm (width) X 1.1mm (height).

4) Pre-Production Run (PPR):
     Minimum Production Run: 4 wafers- PCM guaranteed
     *Wafer Only, w/o Vias.

   Additionally, there are Test & Package Service we offer for one-stop service at one site
   for customers' conveniences.

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