Knowledge*on Inc. :::: 6" InGaP HBT Foundry Service:::::

   Key Features - Backside Via


   Backside via hole process technology of Knowledge*on has been basically developed using
   world top qualified ICP equipment. The final yield of the 6 inch wafer can be decided by how
   reliably backside via holes are composed.
   Knowledge*on has achieved consistent backside via hole process technology and know-how
   through whole wafer using unique sapphire plates and resin thickness control etc.
   Also our excellent grinding and polishing technology before backside via process can assist
   the backside via hole quality as well as the yield.

Back side Via- Uniformity through the wafer