Backside via hole process technology of Knowledge*ON has been basically
developed using world top qualified ICP equipment. The final yield
of the 6 inch wafer can be decided by how reliably backside via holes
are composed.
Knowledge*ON has achieved consistent backside via hole process technology
and know-how through whole wafer using unique sapphire plates and
resin thickness control etc.
Also our excellent grinding and polishing technology before backside
via process can assist the backside via hole quality as well as the
yield.
Back
side Via- Uniformity through the wafer
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